4.8 Article

Laser-Induced Selective Metallization on Polymer Substrates Using Organocopper for Portable Electronics

Journal

ACS APPLIED MATERIALS & INTERFACES
Volume 11, Issue 14, Pages 13714-13723

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsami.9b01856

Keywords

organocopper; polymer; laser activation; selective metallization; laser-induced

Funding

  1. National Natural Science Foundation of China [51773126, 51473104]
  2. Outstanding Youth Foundation of Sichuan Province [2017JQ0006]
  3. Natural Sciences and Engineering Research Council of Canada (NSERC)
  4. State Key Laboratory of Polymer Materials Engineering [sklpme2018-2-09]
  5. China Scholarship Council [201706240131]

Ask authors/readers for more resources

Our work proposed a facile strategy for selective fabrication of the precise metalized patterns onto polymer substrates through the laser direct structuring (LDS) technology using organo-copper compounds. Copper oxalate (CuC2O4) and copper acetylacetonate [Cu(acac)(2)] which can be used as laser sensitizers were first introduced into an acrylonitrile-butadiene-styrene (ABS) matrix for preparing LDS materials. After the activation with 1064 nm pulsed near-infrared laser, the Cu-0 (metal copper) was generated from CuC2O4 and Cu(acac)(2) and then served as catalyst species for the electroless copper plating (ECP). A series of characterizations were conducted to investigate the morphology and analyze the surface chemistry of ABS/CuC2O4 and ABS/Cu(acac)(2) composites. Specially, the X-ray photoelectron spectroscopy analysis indicated that 58.3% Cu2+ in ABS/CuC2O4 was reduced to Cu, while this value was 63.9% for ABS/Cu(acac)(2). After 30 min ECP, the conductivities of copper circuit on ABS/CuC2O4 and ABS/Cu(acac)(2) composites were 1.22 x 10(7) and 1.58 x 10(7) Omega(-1).m(-1), respectively. Moreover, the decorated patterns and near-field communication circuit were demonstrated by this LDS technology. We believe that this study paves the way for developing organocopper-based LDS materials, which have the potential for industrial applications.

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