Pt-wire bonding optimization for electroplated Pt films on γ-Al2O3 for high temperature and harsh environment applications

Published 2018 View Full Article

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Title
Pt-wire bonding optimization for electroplated Pt films on γ-Al2O3 for high temperature and harsh environment applications
Authors
Keywords
Ultrasonic wire bonding, Wedge–wedge bonding, Platinum, High temperature, Surface acoustic waves
Journal
SENSORS AND ACTUATORS A-PHYSICAL
Volume 284, Issue -, Pages 129-134
Publisher
Elsevier BV
Online
2018-10-17
DOI
10.1016/j.sna.2018.10.023

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