Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations

Title
Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations
Authors
Keywords
Stress relaxation, Nanotwin, Copper, HRTEM, Atomistic simulations
Journal
ACTA MATERIALIA
Volume 108, Issue -, Pages 252-263
Publisher
Elsevier BV
Online
2016-03-17
DOI
10.1016/j.actamat.2016.02.021

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