Journal
ACS APPLIED MATERIALS & INTERFACES
Volume 8, Issue 48, Pages 33264-33272Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acsami.6b09960
Keywords
area selective ALD; alkanethiols; self-assembled monolayers; ZnO; metal-dielectric pattern
Funding
- Semiconductor Research Corporation (SRC)
- Intel Corporation
- Kodak Graduate Fellowship
Ask authors/readers for more resources
Area selective atomic layer deposition has the potential to significantly improve current fabrication approaches by introducing a bottom-up process in which robust and conformal thin films are selectively deposited onto patterned substrates. In this paper, we demonstrate selective deposition of dielectrics on metal/dielectric patterns by protecting metal surfaces using alkanethiol blocking layers. We examine alkanethiol self-assembled monolayers (SAMs) with two different chain lengths deposited both in vapor and in solution and show that in both systems, thiols have the ability to block surfaces against dielectric deposition. We show that thiol molecules can displace Cu oxide, opening possibilities for easier sample preparation. A vapor deposited alkanethiol SAM is shown to be more effective than a solution-deposited SAM in blocking ALD, even after only 30 s of exposure. The vapor deposition also results in a much better thiol regeneration process and may facilitate deposition of the SAMs on porous or three-dimensional structures, allowing for the fabrication of next generation electronic devices.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available