Silk-Encapsulated Plasmonic Biochips with Enhanced Thermal Stability

Published 2016 View Full Article

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Title
Silk-Encapsulated Plasmonic Biochips with Enhanced Thermal Stability
Authors
Keywords
-
Journal
ACS Applied Materials & Interfaces
Volume 8, Issue 40, Pages 26493-26500
Publisher
American Chemical Society (ACS)
Online
2016-07-21
DOI
10.1021/acsami.6b07362

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