A molecular dynamics simulation of wear mechanism of diamond tool in nanoscale cutting of copper beryllium
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Title
A molecular dynamics simulation of wear mechanism of diamond tool in nanoscale cutting of copper beryllium
Authors
Keywords
Diamond turning, Nanocutting, Diamond tool, Tool wear
Journal
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
Volume -, Issue -, Pages -
Publisher
Springer Nature
Online
2019-01-05
DOI
10.1007/s00170-018-03246-0
References
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Related references
Note: Only part of the references are listed.- An investigation of tool and hard particle interaction in nanoscale cutting of copper beryllium
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- Anisotropic mechanical amorphization drives wear in diamond
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- XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer
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