Thermal Atomic Layer Etching of Silicon Using O2, HF, and Al(CH3)3 as the Reactants

Title
Thermal Atomic Layer Etching of Silicon Using O2, HF, and Al(CH3)3 as the Reactants
Authors
Keywords
-
Journal
CHEMISTRY OF MATERIALS
Volume 30, Issue 23, Pages 8465-8475
Publisher
American Chemical Society (ACS)
Online
2018-11-06
DOI
10.1021/acs.chemmater.8b02745

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