Metal–metal bonding using silver/copper nanoparticles

Microstructure and mechanical properties of C/C composite/TC4 joint with inactive AgCu filler metal

(2015) Wei Guo et al.   CERAMICS INTERNATIONAL

MD simulation-based study on the melting and thermal expansion behaviors of nanoparticles under heat load

(2015) A. Das et al.   COMPUTATIONAL MATERIALS SCIENCE

Metal–metal bond photochemistry as a tool for understanding the photochemical degradation of plastics

(2015) David R. Tyler   INORGANICA CHIMICA ACTA

Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder

(2015) Xu Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Low-Temperature Metal^|^#8211;Metal Bonding Process Using Leaf-Like Aggregates Composed of CuO Nanoparticles

(2015) Takafumi Maeda et al.   JOURNAL OF CHEMICAL ENGINEERING OF JAPAN

Transferring lead-free piezoelectric ceramics into application

(2015) Jürgen Rödel et al.   JOURNAL OF THE EUROPEAN CERAMIC SOCIETY

Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0Ag–0.5Cu solder alloy

(2015) A.A. El-Daly et al.   MATERIALS & DESIGN

Sonochemical synthesis of porous Cu2O–Cu hollow spheres and their photo-catalysis

(2015) Xiaolin Luo et al.   MATERIALS CHEMISTRY AND PHYSICS

Metastable eutectic in Pb-free joints between Sn–3.5Ag and Ni-based substrates

(2015) S.A. Belyakov et al.   MATERIALS LETTERS

Melting point depression of tin nanoparticles embedded in a stable alpha-alumina matrix fabricated by ball milling

(2015) Pei-Ling Sun et al.   MATERIALS LETTERS

Comparative study of the effect of domain structures on piezoelectric properties in three typical Pb-free piezoceramics

(2014) Shengbo Lu et al.   CERAMICS INTERNATIONAL

On the high strain rate behavior of 63–37 Sn–Pb eutectic solders with temperature effects

(2014) Naveed Iqbal et al.   INTERNATIONAL JOURNAL OF IMPACT ENGINEERING

Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid

(2014) Wen-Hua Li et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

A review: On the development of low melting temperature Pb-free solders

(2014) Hiren R. Kotadia et al.   MICROELECTRONICS RELIABILITY

A metal–metal bonding process using metallic copper nanoparticles produced by reduction of copper oxide nanoparticles

(2014) Yoshio Kobayashi et al.   Journal of Materials Research and Technology-JMR&T

Improving the impact toughness of Sn–Ag–Cu/Cu–Zn Pb-free solder joints under high speed shear testing

(2013) Chi-Yang Yu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Synthesis of silver/copper nanoparticles and their metalmetal bonding property

(2013) Y. Kobayashi et al.   Journal of Mining and Metallurgy Section B-Metallurgy

Metal–Metal Bonding Process Using Cu+Ag Mixed Nanoparticles

(2013) Jianfeng Yan et al.   MATERIALS TRANSACTIONS

The effects of X-ray irradiation and temperature on the formation and stability of chemical species on enargite surfaces during XPS

(2013) Chris Plackowski et al.   MINERALS ENGINEERING

Microstructure of metallic copper nanoparticles/metallic disc interface in metal-metal bonding using them

(2013) Yoshio Kobayashi et al.   SURFACE AND INTERFACE ANALYSIS

XPS study of silver, nickel and bimetallic silver–nickel nanoparticles prepared by seed-mediated growth

(2012) Pilar Prieto et al.   APPLIED SURFACE SCIENCE

Metal–metal bonding process using copper oxide nanoparticles

(2012) T Maeda et al.   SCIENCE AND TECHNOLOGY OF WELDING AND JOINING

Metal–metal bonding process using metallic copper nanoparticles prepared in aqueous solution

(2011) Y. Kobayashi et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

Preparation of CuO nanoparticles by metal salt-base reaction in aqueous solution and their metallic bonding property

(2011) Y. Kobayashi et al.   JOURNAL OF NANOPARTICLE RESEARCH

XPS study of the Cu@Cu2O core-shell nanoparticles

(2008) T. Ghodselahi et al.   APPLIED SURFACE SCIENCE

Influence of ligand structure on the stability and oxidation of copper nanoparticles

(2007) Petri Kanninen et al.   JOURNAL OF COLLOID AND INTERFACE SCIENCE