Molecular dynamics study on the grain boundary dislocation source in nanocrystalline copper under tensile loading

Published 2015 View Full Article

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Title
Molecular dynamics study on the grain boundary dislocation source in nanocrystalline copper under tensile loading
Authors
Keywords
-
Journal
Materials Research Express
Volume 2, Issue 3, Pages 035009
Publisher
IOP Publishing
Online
2015-03-03
DOI
10.1088/2053-1591/2/3/035009

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