Full elastic strain and stress tensor measurements from individual dislocation cells in copper through-Si vias

A Detailed Failure Analysis Examination of the Effect of Thermal Cycling on Cu TSV Reliability

(2014) Chukwudi Okoro et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Synchrotron-based measurement of the impact of thermal cycling on the evolution of stresses in Cu through-silicon vias

(2014) Chukwudi Okoro et al.   JOURNAL OF APPLIED PHYSICS

X-ray microbeam measurements of long-range internal stresses in commercial-purity aluminum processed by multiple passes of equal-channel angular pressing

(2014) Thien Q. Phan et al.   SCRIPTA MATERIALIA

Using X-ray microbeam diffraction to study the long-range internal stresses in aluminum processed by ECAP

(2013) I-Fang Lee et al.   ACTA MATERIALIA

Submicrometre-resolution polychromatic three-dimensional X-ray microscopy

(2012) B. C. Larson et al.   JOURNAL OF APPLIED CRYSTALLOGRAPHY

Validating classical line profile analyses using microbeam diffraction from individual dislocation cell walls and cell interiors

(2012) Lyle E. Levine et al.   JOURNAL OF APPLIED CRYSTALLOGRAPHY

Disordered long-range internal stresses in deformed copper and the mechanisms underlying plastic deformation

(2011) Lyle E. Levine et al.   ACTA MATERIALIA

The Race to X-ray Microbeam and Nanobeam Science

(2011) G. E. Ice et al.   SCIENCE