Copper pillar and memory characteristics using Al2O3 switching material for 3D architecture

Published 2014 View Full Article

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Title
Copper pillar and memory characteristics using Al2O3 switching material for 3D architecture
Authors
Keywords
Resistive memory, Cu pillar, 3D cross-point architecture, High density
Journal
Nanoscale Research Letters
Volume 9, Issue 1, Pages 366
Publisher
Springer Nature
Online
2014-07-27
DOI
10.1186/1556-276x-9-366

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