Journal
APL MATERIALS
Volume 3, Issue 2, Pages -Publisher
AIP Publishing
DOI: 10.1063/1.4907954
Keywords
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Funding
- European Metrology Research Programme (EMRP) Project IND54 Nanostrain
- EMRP participating countries within EURAMET
- European Union
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The determination of the piezoelectric coefficient of thin films using interferometry is hindered by bending contributions. Using finite element analysis (FEA) simulations, we show that the Lefki and Dormans approximations using either single or double-beam measurements cannot be used with finite top electrode sizes. We introduce a novel method for characterising piezoelectric thin films which uses a differential measurement over the discontinuity at the electrode edge as an internal reference, thereby eliminating bending contributions. This step height is shown to be electrode size and boundary condition independent. An analytical expression is derived which gives good agreement with FEA predictions of the step height. (C) 2015 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution 3.0 Unported License.
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