Strategies to Ensure Electromigration Reliability of Cu/Low-k Interconnects at 10 nm

Published 2014 View Full Article

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Title
Strategies to Ensure Electromigration Reliability of Cu/Low-k Interconnects at 10 nm
Authors
Keywords
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Journal
ECS Journal of Solid State Science and Technology
Volume 4, Issue 1, Pages N3168-N3176
Publisher
The Electrochemical Society
Online
2014-11-27
DOI
10.1149/2.0171501jss
References
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