Boron-Based Nanoparticles for Chemical-Mechanical Polishing of Copper Films
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Title
Boron-Based Nanoparticles for Chemical-Mechanical Polishing of Copper Films
Authors
Keywords
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Journal
ECS Journal of Solid State Science and Technology
Volume 2, Issue 1, Pages P20-P25
Publisher
The Electrochemical Society
Online
2012-11-21
DOI
10.1149/2.021301jss
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