Study of Hydrophilic Si Direct Bonding with Ultraviolet Ozone Activation for 3D Integration

Low Temperature Cu-to-Cu Bonding for Wafer-Level Hermetic Encapsulation of 3D Microsystems

(2011) J. Fan et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Low temperature wafer-level bonding for hermetic packaging of 3D microsystems

(2011) C S Tan et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Low Temperature Wafer Bonding of Low-κ Carbon Doped Oxide (CDO) for High Performance 3D IC Application

(2011) C. S. Tan et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Low Temperature PE-TEOS Oxide Bonding Assisted by a Thin Layer of High-κ Dielectric

(2009) G. Y. Chong et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Effect of Wet Pretreatment on Interfacial Adhesion Energy of Cu-Cu Thermocompression Bond for 3D IC Packages

(2009) Eun-Jung Jang et al.   JOURNAL OF ELECTRONIC MATERIALS

Negative charge and charging dynamics in Al[sub 2]O[sub 3] films on Si characterized by second-harmonic generation

(2008) J. J. H. Gielis et al.   JOURNAL OF APPLIED PHYSICS

UV surface exposure for low temperature hydrophilic silicon direct bonding

(2008) Xiaohui Lin et al.   MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS