High-entropy Alloys with High Saturation Magnetization, Electrical Resistivity and Malleability
Published 2013 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
High-entropy Alloys with High Saturation Magnetization, Electrical Resistivity and Malleability
Authors
Keywords
-
Journal
Scientific Reports
Volume 3, Issue 1, Pages -
Publisher
Springer Nature
Online
2013-03-15
DOI
10.1038/srep01455
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Fatigue behavior of Al0.5CoCrCuFeNi high entropy alloys
- (2012) M.A. Hemphill et al. ACTA MATERIALIA
- Local Atomic Structure of a High-Entropy Alloy: An X-Ray and Neutron Scattering Study
- (2012) Wei Guo et al. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
- Microstructure and wear behavior of AlxCo1.5CrFeNi1.5Tiy high-entropy alloys
- (2011) Ming-Hao Chuang et al. ACTA MATERIALIA
- Mechanical properties of Nb25Mo25Ta25W25 and V20Nb20Mo20Ta20W20 refractory high entropy alloys
- (2011) O.N. Senkov et al. INTERMETALLICS
- Microstructure and room temperature properties of a high-entropy TaNbHfZrTi alloy
- (2011) O.N. Senkov et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Magnetic and vibrational properties of high-entropy alloys
- (2011) M. S. Lucas et al. JOURNAL OF APPLIED PHYSICS
- Effect of valence electron concentration on stability of fcc or bcc phase in high entropy alloys
- (2011) Sheng Guo et al. JOURNAL OF APPLIED PHYSICS
- Tensile properties of an AlCrCuNiFeCo high-entropy alloy in as-cast and wrought conditions
- (2011) A.V. Kuznetsov et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Thermal stability and oxidation resistance of laser clad TiVCrAlSi high entropy alloy coatings on Ti–6Al–4V alloy
- (2011) Can Huang et al. SURFACE & COATINGS TECHNOLOGY
- Decomposition in multi-component AlCoCrCuFeNi high-entropy alloy
- (2010) S. Singh et al. ACTA MATERIALIA
- Refractory high-entropy alloys
- (2010) O.N. Senkov et al. INTERMETALLICS
- Evolution of microstructure, hardness, and corrosion properties of high-entropy Al0.5CoCrFeNi alloy
- (2010) Chun-Ming Lin et al. INTERMETALLICS
- Microstructures and soft magnetic properties of nanocrystalline Fe86B13Cu1 alloy annealed by hot isothermal pressing
- (2010) Jiancheng Tang et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Electrical, magnetic, and Hall properties of AlxCoCrFeNi high-entropy alloys
- (2010) Yih-Farn Kao et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Morphology of the boron-rich phase along columnar grain boundary and its effect on the compression crack of Fe–6.5Si–0.05B alloy
- (2010) Huadong Fu et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Solid Solution or Intermetallics in a High-Entropy Alloy
- (2009) Yan Ping Wang et al. ADVANCED ENGINEERING MATERIALS
- Deformation and annealing behaviors of high-entropy alloy Al0.5CoCrCuFeNi
- (2009) Che-Wei Tsai et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Nanocrystalline CoCrFeNiCuAl high-entropy solid solution synthesized by mechanical alloying
- (2009) K.B. Zhang et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Microstructure, thermophysical and electrical properties in AlxCoCrFeNi (0≤x≤2) high-entropy alloys
- (2009) Hsuan-Ping Chou et al. Materials Science and Engineering B-Advanced Functional Solid-State Materials
- Solid-Solution Phase Formation Rules for Multi-component Alloys
- (2008) Y. Zhang et al. ADVANCED ENGINEERING MATERIALS
- Microstructure and tensile behaviors of FCC Al0.3CoCrFeNi high entropy alloy
- (2008) Tao-Tsung Shun et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Effect of alloying elements on microstructure and properties of multiprincipal elements high-entropy alloys
- (2008) C. Li et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Atomic packing efficiency and phase transition in a high entropy alloy
- (2008) F.J. Wang et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Diffusion barrier properties of AlMoNbSiTaTiVZr high-entropy alloy layer between copper and silicon
- (2007) Ming-Hung Tsai et al. THIN SOLID FILMS
Publish scientific posters with Peeref
Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.
Learn MoreFind the ideal target journal for your manuscript
Explore over 38,000 international journals covering a vast array of academic fields.
Search