An extremely thin and robust interconnecting layer providing 76% fill factor in a tandem polymer solar cell architecture

Title
An extremely thin and robust interconnecting layer providing 76% fill factor in a tandem polymer solar cell architecture
Authors
Keywords
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Journal
Journal of Materials Chemistry A
Volume 3, Issue 20, Pages 10681-10686
Publisher
Royal Society of Chemistry (RSC)
Online
2015-04-17
DOI
10.1039/c5ta02205c

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