Journal
IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY
Volume 5, Issue 6, Pages 892-901Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TTHZ.2015.2463673
Keywords
Imaging; metamaterial; Terahertz
Funding
- Engineering and Physical Sciences Research Council [EP/I017461/1, EP/J018678/1]
- CONACyT-Mexico
- EPSRC [EP/I017461/1, EP/J018678/1] Funding Source: UKRI
- Engineering and Physical Sciences Research Council [EP/I017461/1, EP/J018678/1] Funding Source: researchfish
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This paper presents the design of an innovative, low-cost, uncooled, metamaterial-based terahertz (THz) focal plane array (FPA). A single pixel is composed of a resonant metamaterial absorber and micro-bolometer sensor integrated in a standard 180 nm CMOS process. The metamaterial is made directly in the metallic and insulating layers available in the six metal layer CMOS foundry process. THz absorption is determined by the geometry of the metamaterial absorber which can be customized for different frequencies. The initial prototype consists of a 5 5 pixel array with a pixel size of 30 mu m x 30 mu m and is readily scalable to more commercially viable array sizes. The FPA imaging capability is demonstrated in a transmission and reflection mode experiment by scanning a metallic object hidden in a manila envelope.
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