Journal
WEAR
Volume 264, Issue 11-12, Pages 1043-1050Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.wear.2007.08.009
Keywords
junction growth; contact area; elastic-plastic contact; in situ and direct real-time measurement
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The contact area evolution during pre-sliding (junction growth) of copper spheres loaded against a hard sapphire flat is investigated experimentally. Tests are performed with a novel test rig for real-time and in situ direct measurements that provide, for the first time, a new insight of the junction growth mechanism. It is found that junction growth at sliding inception can cause up to 45% increase in the initial contact area that is formed under normal preload alone. Good correlation is found between the present experimental results and a theoretical model for medium and high normal preloads. (c) 2007 Elsevier B.V. All rights reserved.
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