Dry etching of AlN films using the plasma generated by fluoride

The plasma produced by the mixture of fluoride and argon (SF6/Ar) was applied for the dry etching of AlN films. Very high etching rate up to 140 nm/min have been observed. The effects of the bias voltage and the plasma component on the etching results were investigated. It shows that AlN can be effectively etched by the plasma with the moderate SF6 concentration and the etching rate varies linearly with the bias voltage. The FTIR spectra confirm that AlF3 is formed due to the chemical reaction of Al and F atoms. The mechanism of AlN etching in F-based plasma is probably a combination between physical sputtering and chemical etching and can be briefly outlined: (i) F- ions reacts with Al atoms to form low volatile product AlF3 and passivate the surface, and (ii) at the same time the Ar+ ions sputter the reaction product from the surface and keep it fluoride free to initiate further reaction. AlF3 formed on the patterned sidewall play a passivation role during the etching process. The etching process is highly anisotropic with quite smooth surface and vertical sidewalls. (C) 2008 Elsevier Ltd. All rights reserved.