The physical reason for the apparently low deposition rate during high-power pulsed magnetron sputtering

Published 2007 View Full Article

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Title
The physical reason for the apparently low deposition rate during high-power pulsed magnetron sputtering
Authors
Keywords
-
Journal
VACUUM
Volume 82, Issue 8, Pages 867-870
Publisher
Elsevier BV
Online
2007-12-01
DOI
10.1016/j.vacuum.2007.10.011

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