Effect of direct current and pulse plating parameters on tin whisker growth from tin electrodeposits on copper and brass substrates

Optimum Thickness of Sn Film for Whisker Growth

(2011) Jing Cheng et al.   JOURNAL OF ELECTRONIC MATERIALS

Stress Relaxation Mechanisms of Sn and SnPb Coatings Electrodeposited on Cu: Avoidance of Whiskering

(2011) M. Sobiech et al.   JOURNAL OF ELECTRONIC MATERIALS

Whisker Growth Behavior of Sn and Sn Alloy Lead-Free Finishes

(2011) Alongheng Baated et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of intermetallic growth rate on spontaneous whisker growth from a tin coating on copper

(2011) Alongheng Baated et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effect of current density and electrolyte concentration on hillock growth from pure bright Sn electrodeposits

(2010) K.-W. Moon et al.   JOURNAL OF APPLIED ELECTROCHEMISTRY

Pulse plating of matt tin: effect on properties

(2010) A. Vicenzo et al.   TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes

(2008) E. Chason et al.   APPLIED PHYSICS LETTERS