Role of surfactants in construction of porous copper film by electrodeposition approach

Porous copper films have been successfully electrodeposited using a hydrogen bubble template. The cationic surfactant cetyl trimethylammonium bromide, the anionic surfactant sodium dodecyl sulphate, the non-ionic surfactant alkylphenol polyoxyethylene and combined surfactants were used as additives to the electroplating baths. The purpose was to evaluate the effects of these surfactants on the microstructure and morphology of porous electrodeposited copper films. X-ray diffraction results show an obvious difference in the crystallinities of porous copper films derived from baths containing different surfactants. Field emission scanning electron microscopy micrographs reveal that both the size and morphology of the pore walls acutely depend on the type of surfactant.