Preparation of SiCp/A356 electronic packaging materials and its thixo-forging

The rapid development of electronic packaging industry has resulted in higher requirement for packaging materials. The packaging material of SiC reinforced A356 aluminum alloy was fabricated by mechanical mixing method, and the SiCP/Al composite billet was formed by thixo-forging to manufacture the electronic packaging shell. The microstructure of the produced part was investigated. Two different thixo-forging procedures for manufacturing electronic packaging shell were analyzed. The results show that after being heated to 600 degrees C and held for 3 h, SiCp has good compatibility with A356 aluminum alloy and the SiCp/A356 composite billet can meet the requirements of thixo-forging. When the billet was remelted to 580 degrees C, held for 10 min, the homogeneous microstructure with the best thixo-formability can be realized. The thixo-forging of electronic packaging shell is feasible.