High-luminance and high-efficiency multi-chip light-emitting diode array packaging platform with nanoscale anodized aluminum oxide on silicon substrate

Published 2013 View Full Article

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Title
High-luminance and high-efficiency multi-chip light-emitting diode array packaging platform with nanoscale anodized aluminum oxide on silicon substrate
Authors
Keywords
-
Journal
THIN SOLID FILMS
Volume 557, Issue -, Pages 346-350
Publisher
Elsevier BV
Online
2013-11-21
DOI
10.1016/j.tsf.2013.11.019

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