Failure mechanism of copper through-silicon vias under biased thermal stress

Published 2013 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Failure mechanism of copper through-silicon vias under biased thermal stress
Authors
Keywords
-
Journal
THIN SOLID FILMS
Volume 546, Issue -, Pages 14-17
Publisher
Elsevier BV
Online
2013-05-19
DOI
10.1016/j.tsf.2013.05.039

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.