Effects of the substrate temperature on the Cu seed layer formed using atomic layer deposition

Title
Effects of the substrate temperature on the Cu seed layer formed using atomic layer deposition
Authors
Keywords
-
Journal
THIN SOLID FILMS
Volume 519, Issue 11, Pages 3636-3640
Publisher
Elsevier BV
Online
2011-02-03
DOI
10.1016/j.tsf.2011.01.346

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