A non-contact, thermally-driven buckling delamination test to measure interfacial fracture toughness of thin film systems

Title
A non-contact, thermally-driven buckling delamination test to measure interfacial fracture toughness of thin film systems
Authors
Keywords
-
Journal
THIN SOLID FILMS
Volume 518, Issue 8, Pages 2056-2064
Publisher
Elsevier BV
Online
2009-07-27
DOI
10.1016/j.tsf.2009.07.148

Ask authors/readers for more resources

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started