Interdiffusion and stress development in Cu–Pd thin film diffusion couples

Published 2008 View Full Article

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Title
Interdiffusion and stress development in Cu–Pd thin film diffusion couples
Authors
Keywords
-
Journal
THIN SOLID FILMS
Volume 516, Issue 21, Pages 7615-7626
Publisher
Elsevier BV
Online
2008-05-22
DOI
10.1016/j.tsf.2008.05.011

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