Copper-catalyzed Ullmann coupling under ligand- and additive-free conditions. Part 2: S-Arylation of thiols with aryl iodides

Published 2008 View Full Article

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Title
Copper-catalyzed Ullmann coupling under ligand- and additive-free conditions. Part 2: S-Arylation of thiols with aryl iodides
Authors
Keywords
-
Journal
TETRAHEDRON LETTERS
Volume 49, Issue 12, Pages 2023-2025
Publisher
Elsevier BV
Online
2008-01-17
DOI
10.1016/j.tetlet.2008.01.060

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