Journal
SURFACE AND INTERFACE ANALYSIS
Volume 41, Issue 1, Pages 69-74Publisher
WILEY
DOI: 10.1002/sia.2994
Keywords
electroless plating; copper; silicon; surface chemical reaction; 4-vinylpyridine
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Funding
- Youths Science Foundation of Wuhan Institute of Technology [Q200909]
- Hubei Province Educational Bureau [Q20081506]
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Surface-initiated atom-transfer radical polymerization (ATRP) of 4-vinylpyridine (4VP) on a pretreated Si(100) surface was carried out. The composition and topography of the Si(100) surface modified by poly(4-vinylpyridine) IMP) were characterized by XPS and atomic force microscopy (AFM), respectively. The P4VP layer on the Si(100) surface was used not only as chemisorption sites for the palladium complexes without prior sensitization by SnCl2 solution during the electroless plating, but also as an adhesion promotion layer for the electrolessly deposited copper. The electrolessly deposited copper on the Si-P4VP surface exhibited a 180 degrees peel adhesion strength above 6 N/cm. The adhesion strength was much higher than that of the electrolessly deposited copper to the pristine silicon surface. Copyright (C) 2008 John Wiley & Sons, Ltd.
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