Analysis of interface impurities in electroplated Cu layers by using GD-OES and TOF-SIMS

Title
Analysis of interface impurities in electroplated Cu layers by using GD-OES and TOF-SIMS
Authors
Keywords
-
Journal
SURFACE AND INTERFACE ANALYSIS
Volume 40, Issue 3-4, Pages 418-422
Publisher
Wiley
Online
2008-03-03
DOI
10.1002/sia.2743

Ask authors/readers for more resources

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search