Article
Engineering, Electrical & Electronic
Wei Xu, Xiaoyi Wang, Xiaofang Pan, Amine Bermak, Yi-Kuen Lee, Yatao Yang
Summary: This article presents a wafer-level packaged Pirani vacuum gauge using InvenSense CMOS MEMS technology, demonstrating high performance and integration for vacuum monitoring. The Pirani vacuum gauge achieves high sensitivity and low heating power in a very fine vacuum regime.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2021)
Article
Engineering, Electrical & Electronic
Vikram Maharshi, Imran Ahmad, Ajay Agarwal, Bhaskar Mitra
Summary: This work presents a novel wafer-level vacuum packaging technique using recrystallized parylene as the bonding layer for MEMS. The thermal annealing process was demonstrated to enhance the crystallinity of the parylene surface, improving its moisture and air barrier properties. The mechanical stability of the bond interface was investigated, and a Ti getter was integrated to create vacuum for testing hermeticity. The recrystallized parylene bonded micro package exhibited better hermeticity compared to the non-recrystallized parylene micro package.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
(2023)
Article
Engineering, Electrical & Electronic
Mustafa Mert Torunbalci, Hasan Dogan Gavcar, Ferhat Yesil, Said Emre Alper, Tayfun Akin
Summary: The paper introduces a novel and simple all-silicon wafer-level fabrication and hermetic packaging method for MEMS devices. The method achieves hermetic sealing and signal transfer without complex process steps, with a low package vacuum and high bonding strength. MEMS resonators fabricated and packaged using this method show significant enhancements in bias instability and temperature sensitivity compared to traditional technologies.
IEEE SENSORS JOURNAL
(2021)
Article
Chemistry, Analytical
Jun Liu, Shanhong Xia, Chunrong Peng, Zhengwei Wu, Zhaozhi Chu, Zhouwei Zhang, Hucheng Lei, Fengjie Zheng, Wei Zhang
Summary: This paper proposes a novel wafer-level vacuum packaged electric field microsensor with high quality factor, low driving voltage, low noise, and low power consumption. The microsensor utilizes a silicon-on-insulator (SOI) conductive handle layer for sensing and achieves vacuum packaging through anodic bonding between the SOI and glass-on-silicon (GOS). The experimental results demonstrate the excellent performance of the microsensor, including high sensitivity, low feedthrough, and long-term stability.
Article
Chemistry, Analytical
Taehyun Kim, Sangwug Han, Jubum Lee, Yeeun Na, Joontaek Jung, Yun Chang Park, Jaesub Oh, Chungmo Yang, Hee Yeoun Kim
Summary: This research proposes a low-temperature wafer-level vacuum packaging technology based on Cu-Sn bonding and nano-multilayer getter materials for microbolometers. The optimized Cu/Cu3Sn/Cu microstructure is achieved by adjusting the bonding temperature, pressure, and time. The Zr-Ti-Ru based nanomultilayer getter coating with high step height is improved by self-aligned shadow masking. The packaged samples show a narrow distribution of vacuum level near 50 mTorr.
Article
Chemistry, Analytical
Yingyu Xu, Shuibin Liu, Chunhua He, Heng Wu, Lianglun Cheng, Qinwen Huang, Guizhen Yan
Summary: This paper proposes a gas leakage model for evaluating the packaging reliability of wafer-level MEMS gyroscopes. The relationships between the quality factor, gas molecule number, and a quality factor degradation model are derived and the mechanism of the effect of gas leakage on the quality factor is explored. Experimental results confirm the exponential relationship between the reciprocal of the quality factor and gas leakage time, providing theoretical basis for improving packaging process.
Article
Chemistry, Physical
Ali Roshanghias, Jochen Bardong, Alfred Binder
Summary: This study proposes and investigates a new method for using jet printing of glass frit materials at the wafer level. The jetting parameters were optimized and the effect of jetted pitch size on bond-line thickness was assessed. The results reveal that jet printing of glass frit is a straightforward, cost-effective, and flexible approach with significant implications for hermetic packaging.
Article
Engineering, Electrical & Electronic
Hengmao Liang, Xiao He, Bin Xiong
Summary: In this study, a novel 3D wafer-level vacuum packaging technology for MEMS is presented, which utilizes Au-Si eutectic bonding and demonstrates excellent package performances. The technology is characterized by high mechanical strength, low capacitive feed-through effect, and good long-term stability, making it suitable for various MEMS devices.
IEEE SENSORS JOURNAL
(2022)
Article
Engineering, Electrical & Electronic
Yukio Suzuki, Victor Dupuit, Toshiya Kojima, Yoshiaki Kanamori, Shuji Tanaka
Summary: Silicon migration seal (SMS) wafer-level packaging is proposed for high vacuum encapsulation of MEMS. The feasibility of SMS packaging was experimentally demonstrated using 4-inch wafers, confirming hermetic sealing.
ELECTRONICS AND COMMUNICATIONS IN JAPAN
(2021)
Article
Engineering, Electrical & Electronic
Manu Garg, Dhairya S. Arya, Sumit Sharma, Sushil Kumar, Wasi Uddin, Samaresh Das, Yi Chiu, Pushpapraj Singh
Summary: The study introduces a high-sensitivity metal oxide (V2O5) based NEMS Pirani gauge for pressure monitoring of a packaged device, which increases sensing area and allows in-situ monitoring by removing additional supplementary materials. The design is simulated, validated with experimental results, and shows good sensitivity and stability in the working range.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
(2021)
Proceedings Paper
Engineering, Electrical & Electronic
Kai Zoschke, Charles Alix Manier, Hermann Oppermann, Dirk Meier, Nishant Malik, Elahe Zakizade, Marvin Michel, Avisek Roy, Hoang-Vu Nguyen, Thanh-Phuc Nguyen
Summary: This paper presents novel technology developments for vacuum wafer level packaging of microbolometer arrays used in thermal infrared sensors for automotive, safety, and security/surveillance applications. The paper introduces the concept of fabricating large cap structures on temporary carrier wafers and transferring them to device wafers for wafer level vacuum packaging. The paper discusses the process flows, alternative process options, and results of the capping approaches.
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC
(2023)
Article
Engineering, Electrical & Electronic
Ping Guo, Hongling Meng, Lin Dan, Jianye Zhao
Summary: This article proposes a wafer-level assembled physics package for chip-scale atomic clocks (CSACs). The method, based on 3-D wafer-level packaging and MEMS technologies, offers high uniformity and efficiency, resulting in reduced production cost.
IEEE SENSORS JOURNAL
(2022)
Article
Chemistry, Analytical
Wenchao Tian, Ran Gao, Lin Gu, Haoyue Ji, Liming Zhou
Summary: In order to meet the demands for miniaturization and high-performance electronics, the semiconductor industry has shifted its packaging approach to multi-chip vertical stacking. However, electromigration (EM) problem on the micro-bump has remained a persistent issue affecting the reliability of advanced packaging technologies. This study investigates the relationship between loading conditions and EM failure time in micro-bump structures through numerical simulations and determines the impact of operating temperature and current density on EM lifetime.
Article
Engineering, Manufacturing
Yu-Ting Huang, Yi-Chieh Tsai, Yi-Cheng Huang, Han-Wen Hu, Kuan-Neng Chen
Summary: In this article, a glass-based hermetic structure with a thickness thinner than 200 $\mu \text{m}$ and a size smaller than 1 mm2 is introduced, showing the potential for realizing the miniaturization of microelectromechanical systems (MEMS) with high throughput. The material selection of metal wire for the development of this new wafer-level packaging platform is studied. The technique of metal patterning on the cavity structure is demonstrated for the fabrication of seal ring and electrical connection simultaneously. Finally, the ultrathin hermetic structure is sealed by metal-to-metal bonding at wafer level. These technologies can be widely used in advanced miniaturized packaging applications for next-generation electronic components.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
(2023)
Article
Automation & Control Systems
Fumihiro Inoue, Alain Phommahaxay, Yohei Gokita, Berthold Moeller, Eric Beyne
Summary: The surface planer process was used to minimize the nonuniformity caused by the nonoptimized Cu pillar and Si thinning processes. The planarized Cu pillars showed a substantial reduction in height variation, and the surface of the pillars became flat and uniform. The thickness variation of the backgrind tape-laminated Cu pillar wafer and the Si thinning were significantly reduced by the surface planer process. These results indicate that the surface planer process is a promising method for achieving high coplanarity and advancing advanced packaging.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
(2022)
Article
Engineering, Electrical & Electronic
Huai Zheng, Xiaobing Luo
IEEE PHOTONICS TECHNOLOGY LETTERS
(2013)
Article
Engineering, Electrical & Electronic
Run Hu, Shan Yu, Yong Zou, Huai Zheng, Fei Wang, Sheng Liu, Xiaobing Luo
IEEE PHOTONICS TECHNOLOGY LETTERS
(2013)
Article
Engineering, Electrical & Electronic
Quan Chen, Qi Chen, Sheng Liu, Xiaobing Luo
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
(2014)
Article
Thermodynamics
Xing Fu, Xiaobing Luo
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
(2013)
Article
Thermodynamics
Xiaobing Luo, Xing Fu, Fei Chen, Huai Zheng
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
(2013)
Article
Thermodynamics
Chao Yuan, Xiaobing Luo
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
(2013)
Article
Thermodynamics
Run Hu, Ting Cheng, Lan Li, Jinlong Ma, Xiaobing Luo
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
(2014)
Article
Thermodynamics
Xiaobing Luo, Run Hu
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
(2014)
Article
Physics, Applied
Jinlong Ma, XinJiang Wang, Baoling Huang, Xiaobing Luo
JOURNAL OF APPLIED PHYSICS
(2013)
Article
Physics, Applied
Run Hu, Yiman Wang, Yong Zou, Xing Chen, Sheng Liu, Xiaobing Luo
JOURNAL OF APPLIED PHYSICS
(2013)
Article
Engineering, Electrical & Electronic
Huai Zheng, Sheng Liu, Xiaobing Luo
JOURNAL OF LIGHTWAVE TECHNOLOGY
(2013)
Article
Materials Science, Multidisciplinary
Jinlong Ma, Wu Li, Xiaobing Luo
Article
Multidisciplinary Sciences
Run Hu, Xuli Wei, Jinyan Hu, Xiaobing Luo
SCIENTIFIC REPORTS
(2014)
Proceedings Paper
Energy & Fuels
Bimrew Tamrat Admasu, Xiaobing Luo, Jiawei Yao, Tingzhen Ming
SOLAR UPDRAFT TOWER POWER TECHNOLOGY
(2013)
Proceedings Paper
Engineering, Electrical & Electronic
Bimrew Tamrat Admasu, Xiaobing Luo
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
(2013)
Article
Engineering, Electrical & Electronic
Kehao Feng, Zhenghua Zhang, Guohua Bai, Xiuyuan Fan, Rongzhi Zhao, Xuefeng Zhang
Summary: This paper proposes a new method to accurately evaluate the high-frequency power loss of soft magnetic materials. Through a two-step calibration, the system is able to compensate for the phase angle discrepancy between the exciting current and induced voltage, enabling a higher power loss measurement frequency.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)
Article
Engineering, Electrical & Electronic
Mingfang Kang, Tong Liu, Hongmei Sun, Lin Li, Keliang Wang
Summary: In this study, the absorption performance of ambient nitrogenous toxic gases on a monolayer of blue phosphorus phase germanium selenide (GeSe) was investigated using density-functional theory calculations. The results showed that GeSe monolayer exhibits higher sensitivity and selectivity for the hazardous gas NO.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)
Article
Engineering, Electrical & Electronic
Yaqiong Niu, Zhicheng Zou, Longsheng Cheng, Chaofeng Ye
Summary: This paper proposes a novel method to stabilize the laser diode output using a close-loop control with two feedbacks. The proposed method performs better for long-time operations.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)
Article
Engineering, Electrical & Electronic
Jiajie Li, Ying Liu, Zhen Chai, Qian Cao, Renjie Li, Yueyang Zhai
Summary: This study proposed an efficient and high-quality beam-splitting method based on a diffractive optical element, enabling multichannel SERF atomic magnetometers to achieve ultra-high consistency and sensitivity. It has significant applications in array biomagnetic measurement systems.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)
Article
Engineering, Electrical & Electronic
E. Oliveira, C. Doering, H. Fouckhardt
Summary: With the development of Lab on a chip technology, fluid management using dispersed droplets has become an important approach. Electrowetting on dielectric (EWOD) is one method for droplet actuation, but it requires prior definition of droplet positions. Optoelectrowetting (OEW) goes further by allowing changes in electrical parameters through impinging light spots, without the need for predefined droplet positions. This study re-evaluates the key parameters of OEW and explores their effects on droplet actuation using numerical optimization methods.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)
Article
Engineering, Electrical & Electronic
Haipeng Wang, Zhiguo Wang, Gancheng Zhu, Shuai Zhang
Summary: A novel capacitive proximity skin was developed to improve the performance of robotics in handling liquid-filled containers. This skin features a flexible structure that can adapt to different grippers and seamlessly integrate with Robot Operating System. Experimental results demonstrated that this proximity skin achieved data-lossless detection and contactless measurement of liquid level, making it suitable for grasping operations.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)
Article
Engineering, Electrical & Electronic
Tsenguun Byambadorj, Xiangyu Zhao, Yutao Qin, Yogesh B. Gianchandani
Summary: In this research, a monolithically microfabricated Knudsen pump (KP) without suspended membranes was presented. These pumps offer improved mechanical robustness, wider process window, and simplified microfabrication process compared to previous designs. The experimental results matched the modeling results well, indicating the potential for monolithic integration onto complex lab-on-a-chip systems.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)
Article
Engineering, Electrical & Electronic
Hamed Karami, Saeed Karami Chemeh, Vahid Azizi, Hooman Sharifnasab, Jose Ramos, Mohammed Kamruzzaman
Summary: Aroma is a significant quality trait for pharmaceutical plants and their products, indicating the quality of the raw material. An electronic nose is an efficient approach for identifying and evaluating the aroma of essential oils. In this study, tarragon was dried at different temperatures and air velocities, and the purity of tarragon essential oil was evaluated using an electronic nose. Multivariate data analysis and artificial neural networks modeling were employed to quantify and classify the obtained essential oils.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)
Article
Engineering, Electrical & Electronic
Xiaoyang Duan, Dan Xu, Wenjun Jia, Ran Li, Bohao Sun, Ruitian Yan, Wenjie Zhao
Summary: Flower-like WO3/WS2 heterojunction materials constructed via a low-temperature in-situ oxidation method exhibit significant improvements in the detection of NO2 gas in gas sensors, along with good selectivity and reproducibility.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)
Article
Engineering, Electrical & Electronic
Peng Yu, Mengyang Zhang, Manqi You, Yuxi Gao, Landong Xiao, Yan Peng, Jingxia Lai, Zhouzhao Shi, Siwei Luo, Gencai Guo, Gang Guo
Summary: Recent studies have shown that two-dimensional Janus transition metal dichalcogenides (TMDs) have great potential for applications in gas sensors. By conducting first principles calculations, this study explores the potential application of Pd-doped monolayer HfSeS as gas sensor materials for detecting CO, CO2, NH3, and NO. The results demonstrate the good thermodynamical stability and reversible adsorption of these molecules on both pristine and Pd-doped HfSeS, with Pd-doped HfSeS showing higher sensitivity towards NO due to its metallic behavior upon NO adsorption.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)
Article
Engineering, Electrical & Electronic
Jinlan Yang, Linjiao Li, Jun Huang, Quan Zhang, Hiba Affane
Summary: This study proposes a method for large-scale aggregation of micro-particles by creating a vortex region using low-frequency oscillation. Experimental results show that this method can achieve a large aggregation area and has the advantages of low cost and low power consumption.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)
Article
Engineering, Electrical & Electronic
Jitendra Singh, Saurabh Kumar Gupta, Vinita
Summary: In this investigation, a Surface Acoustic Wave (SAW) formalin gas sensor was explored for low-level formalin gas sensing applications. The sensor showed stable response and high sensitivity to formalin gas concentration, making it a reliable and useful sensor for room temperature operations.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)
Article
Engineering, Electrical & Electronic
Junyao Wang, Yahao Liu, Huan Liu, Qi Hou, Jianxin Xu, Hongxu Pan, Jingran Quan, Yansong Chen, Hanbo Yang, Lixiang Li
Summary: A flexible electrode with a serpentine-shaped tetra-chiral structure was designed to improve the mechanical properties and prevent mechanical fracture of flexible electrodes. The research demonstrated that this structure reduced the maximum tensile stress by 87.19% compared to the existing tetra-chiral structure. The flexible electrode remained conductive even at a strain of 70% and showed resistance values of 5 ohm and 4.4 ohm at a bending angle of 180 degrees and after 1000 fold cycles. Furthermore, the flexible electrodes showed great potential in biological signal monitoring, particularly in collecting ECG and pulse signals.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)
Article
Engineering, Electrical & Electronic
Taihao Chen, Yong Fang, Mengru Zhu, Zhiwei Zhao, Wei Lei, Zhuoya Zhu, Helong Jiang
Summary: Flexible dual-spectral carbon nanodots/flexible n-silicon heterojunction photodetectors with high responsivity and detectivity are reported. These detectors show photo response in UV illumination and only in forward bias under visible illumination. The photocurrent of the device remains high even under bending strain.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)
Article
Engineering, Electrical & Electronic
M. S. Sikandar Bathusha, Israr Ud Din, Rehan Umer, Kamran A. Khan
Summary: Graphene-based nanomaterials are used as embedded sensors to monitor fracture behavior in composite structures. This study investigates the in-situ crack propagation and fracture behavior in a glass fiber reinforced polymer composite using embedded reduced graphene oxide coated fabrics and highly conductive graphene nanoplatelet paper.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)