4.7 Article

Frequency-controlled wireless shape-memory-alloy microactuators integrated using an electroplating bonding process

Journal

SENSORS AND ACTUATORS A-PHYSICAL
Volume 163, Issue 1, Pages 363-372

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.sna.2010.08.007

Keywords

Shape-memory-alloys; Micro-electro-mechanical systems; Actuators; Grippers; Wireless; Electroplating; Bonding

Funding

  1. Natural Sciences and Engineering Research Council of Canada
  2. Canada Foundation for Innovation
  3. British Columbia Knowledge Development Fund
  4. CMC Microsystems

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This paper reports the wireless control of bulk-micromachined shape-memory-alloy actuators using external radiofrequency magnetic fields and its application to microgrippers. The frequency-sensitive wireless resonant heater to which the gripper actuator is bonded is activated only when the field frequency is tuned to the resonant frequency of the heater. A batch-compatible bonding technique based on photo-defined copper electroplating is developed to mechanically and thermally couple the gripper with the planar heater circuit fabricated using copper-clad polyimide film. The actuation range of 600 mu m as the tip opening distance is obtained with normally closed 5-mm long grippers at a device temperature of 92 degrees C. The field frequency range to which the devices with 140-MHz resonant frequency respond is measured to be similar to 13 MHz about the resonant frequency. The manipulation of vertically aligned carbon-nanotube forests is experimentally demonstrated. Mechanical stress tests for the bond formed by the developed electroplating bonding method show a shear strength greater than 40 MPa. (c) 2010 Elsevier B.V. All rights reserved.

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