Journal
SENSORS AND ACTUATORS A-PHYSICAL
Volume 152, Issue 1, Pages 96-103Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.sna.2009.03.016
Keywords
Sidewall micropatterns; Si-reinforced PDMS molds; Hot embossing
Funding
- NSF [CMMI-0811888]
- Directorate For Engineering
- Div Of Civil, Mechanical, & Manufact Inn [0811888] Funding Source: National Science Foundation
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Existing lithographic approaches are good at patterning the top surface of a substrate, but not suited to producing patterns on the sidewalls of microstructures. In this work, we have developed a new method to generate sidewall micropatterns using Si-reinforced polydimethylsiloxane (PDMS) molds through hotembossing processes. We have successfully produced one and two arrays of 10 mu m Au dots, respectively, on the 42- and 85-mu m-high sidewalls of 300-mu m-wide polymer channels. We have also explored the possibility to fabricate 110-mu m-wide Au wires on these channel sidewalls. (C) 2009 Elsevier B.V. All rights reserved.
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