Wafer-level fabrication of GaN-based vertical light-emitting diodes using a multi-functional bonding material system

Published 2009 View Full Article

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Title
Wafer-level fabrication of GaN-based vertical light-emitting diodes using a multi-functional bonding material system
Authors
Keywords
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Journal
SEMICONDUCTOR SCIENCE AND TECHNOLOGY
Volume 24, Issue 9, Pages 092001
Publisher
IOP Publishing
Online
2009-08-13
DOI
10.1088/0268-1242/24/9/092001
References
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