On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints

Title
On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints
Authors
Keywords
-
Journal
SCRIPTA MATERIALIA
Volume 66, Issue 8, Pages 586-589
Publisher
Elsevier BV
Online
2012-01-13
DOI
10.1016/j.scriptamat.2012.01.009

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