Bonding characteristics during very high power ultrasonic additive manufacturing of copper

Authors

Keywords

Journal

Volume 62, Issue 8, Pages 560-563

Publisher

Elsevier BV

Online

2010-01-05

DOI

10.1016/j.scriptamat.2009.12.040

Discuss science. Find collaborators. Network.

Join a conversation

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started