Achievement of a near-perfect smooth silicon surface

Effect of hydrogen peroxide concentration on surface micro- roughness of silicon wafer after final polishing

(2011) Haibo Wang et al.   MICROELECTRONIC ENGINEERING

Dynamic phase transformation of crystalline silicon under the dry and wet impact studied by molecular dynamics simulation

(2010) Ruling Chen et al.   JOURNAL OF APPLIED PHYSICS

Monoatomic layer removal mechanism in chemical mechanical polishing process: A molecular dynamics study

(2010) Lina Si et al.   JOURNAL OF APPLIED PHYSICS

Performance of Sodium Dodecyl Sulfate in Slurry with Glycine and Hydrogen Peroxide for Copper-Chemical Mechanical Polishing

(2010) Yan Pan et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Blue LED growth from 2 inch to 8 inch

(2010) Frank Lu et al.   Science China-Technological Sciences

Dependence of pad performance on its texture in polishing mono-crystalline silicon wafers

(2009) L.C. Zhang et al.   INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES

Effects of dielectric barrier discharges on silicon surfaces: Surface roughness, cleaning, and oxidation

(2009) B. Michel et al.   JOURNAL OF APPLIED PHYSICS

Extrusion formation mechanism on silicon surface under the silica cluster impact studied by molecular dynamics simulation

(2008) Ruling Chen et al.   JOURNAL OF APPLIED PHYSICS

Effects of Polishing Pressure on Electrochemical Characteristics of Silicon Wafers during CMP

(2008) Xiaolan Song et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effect of Nanoparticle Impact on Material Removal

(2008) Xuefeng Xu et al.   TRIBOLOGY TRANSACTIONS