Assembly of N type Bi2(Te, Se)3thermoelectric modules by low temperature bonding

Critical Concerns in Soldering Reactions Arising from Space Confinement in 3-D IC Packages

(2012) H. Y. Chuang et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Joining highly conductive and oxidation resistant silver-based electrode materials to silicon for high temperature thermoelectric energy conversions

(2012) Yong X. Gan et al.   MATERIALS CHEMISTRY AND PHYSICS

High temperature CoSb3–Cu junctions

(2011) Krzysztof Tomasz Wojciechowski et al.   MICROELECTRONICS RELIABILITY

Thermoelectricity of nanocomposites containing TiO2–CoO coaxial nanocables

(2011) Lusheng Su et al.   SCRIPTA MATERIALIA

Elimination of voids in reactions between Ni and Sn: A novel effect of silver

(2011) H.Y. Chuang et al.   SCRIPTA MATERIALIA

Effect of Ag addition in Sn on growth of SnTe compound during reaction between molten solder and tellurium

(2010) Chien-Neng Liao et al.   JOURNAL OF MATERIALS RESEARCH

Thermoelectric property of PbTe coating on copper and nickel

(2009) Ravinder Madhavaram et al.   MATERIALS CHEMISTRY AND PHYSICS

Electrodeposition and morphology analysis of Bi–Te thermoelectric alloy nanoparticles on copper substrate

(2009) Yong X. Gan et al.   MATERIALS LETTERS

Die-attachment solutions for SiC power devices

(2009) R. Kisiel et al.   MICROELECTRONICS RELIABILITY

Interfacial evolution behavior and reliability evaluation of CoSb3/Ti/Mo–Cu thermoelectric joints during accelerated thermal aging

(2008) Degang Zhao et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Suppression of vigorous liquid Sn/Te reactions by Sn–Cu solder alloys

(2008) Chien-Neng Liao et al.   JOURNAL OF MATERIALS RESEARCH

Development of low resistance electrical contacts for thermoelectric devices based on n-type PbTe and p-type TAGS-85 ((AgSbTe2)0.15(GeTe)0.85)

(2008) Ajay Singh et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Complex thermoelectric materials

(2008) G. Jeffrey Snyder et al.   NATURE MATERIALS