Thermal contact conductance of demountable in vacuum copper-copper joint between 14 and 100 K

Title
Thermal contact conductance of demountable in vacuum copper-copper joint between 14 and 100 K
Authors
Keywords
-
Journal
REVIEW OF SCIENTIFIC INSTRUMENTS
Volume 83, Issue 3, Pages 034902
Publisher
AIP Publishing
Online
2012-03-28
DOI
10.1063/1.3697693

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