Thermal- and solution-processable polyimides based on mellophanic dianhydride and their applications as heat-resistant adhesives for copper-clad laminates

Title
Thermal- and solution-processable polyimides based on mellophanic dianhydride and their applications as heat-resistant adhesives for copper-clad laminates
Authors
Keywords
-
Journal
REACTIVE & FUNCTIONAL POLYMERS
Volume 71, Issue 2, Pages 109-120
Publisher
Elsevier BV
Online
2010-11-25
DOI
10.1016/j.reactfunctpolym.2010.11.021

Ask authors/readers for more resources

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now