From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films

Published 2015 View Full Article

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Title
From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films
Authors
Keywords
Phase separation, Interconnected percolating metallic networks, Refractory solid solution, Thermally activated processes, Tungsten–copper microstructure evolution
Journal
ACTA MATERIALIA
Volume 99, Issue -, Pages 213-227
Publisher
Elsevier BV
Online
2015-08-12
DOI
10.1016/j.actamat.2015.07.050

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