Low thermal conductivity in ternary Cu 4 Sn 7 S 16 compound

Published 2015 View Full Article

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Title
Low thermal conductivity in ternary Cu 4 Sn 7 S 16 compound
Authors
Keywords
Thermoelectric, Sulfide material, Mechanical alloying, Powder X-ray diffraction, HRTEM, HAADF-STEM, Tweed structure, Mössbauer spectroscopy
Journal
ACTA MATERIALIA
Volume 97, Issue -, Pages 180-190
Publisher
Elsevier BV
Online
2015-07-13
DOI
10.1016/j.actamat.2015.06.046

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