3.9 Article

New Bismaleimide-Epoxy Resin System

Journal

POLYMER-PLASTICS TECHNOLOGY AND ENGINEERING
Volume 48, Issue 5, Pages 525-529

Publisher

TAYLOR & FRANCIS INC
DOI: 10.1080/03602550902824325

Keywords

Allyl-epoxy resins; Ene-reaction; Thermal curing

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New functional epoxy resins were prepared by the reaction of dialyldiglycicylbisphenol A (DADGBPA) with diaminodiphenylmethane. DADGBPA was prepared by reaction of o,o'-diallylbisphenol A with epichlorhydrine. By reaction of functional epoxy resins with bismaleimides, new epoxy-bismaleimide resins with good thermostability were obtained. The thermal properties of epoxy resins and epoxy-bismaleimide resins were determined by DSC and TGA measurements.

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