Journal
POLYMER TESTING
Volume 30, Issue 4, Pages 349-355Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.polymertesting.2011.02.005
Keywords
Epoxy resin; POSS; Curing kinetics; Acceleration
Funding
- HFUT
- Anhui Educational Department
- Natural Science Foundation of Anhui Province [11040606M58]
Ask authors/readers for more resources
Polyhedral Oligomeric Silsesquioxane (POSS) with highly reactive epoxy groups will have a strong effect on the curing process and the final structure of epoxy resin (EP) composites. The Kissinger and isoconversional methods are widely used in treatment of the non-isothermal curing process during a DSC run. Results obtained from Kissinger analysis showed that the curing activation energy E of the EP/epoxide POSS system is effectively lowered after addition of POSS. More precise analysis, including the Coats-Redfern and Friedman methods, showed that introduction of epoxide POSS greatly accelerated the curing process of EP. The activation energy of the composites was much lower than that of the pure resin in the early stage. Subsequently, it increased with the increase in conversion. Combining the results obtained from glass transition temperature measurement, it was clear that the dispersion state of POSS has a huge effect on the curing kinetics of the EP/POSS composites. (C) 2011 Elsevier Ltd. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available