A molecular dynamics study of tensile strength between a highly-crosslinked epoxy molding compound and a copper substrate

Published 2013 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
A molecular dynamics study of tensile strength between a highly-crosslinked epoxy molding compound and a copper substrate
Authors
Keywords
-
Journal
POLYMER
Volume 54, Issue 18, Pages 5064-5074
Publisher
Elsevier BV
Online
2013-07-11
DOI
10.1016/j.polymer.2013.07.019

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.