4.5 Article

On the Plasma Chemistry During Plasma Enhanced Chemical Vapor Deposition of Microcrystalline Silicon Oxides

Journal

PLASMA PROCESSES AND POLYMERS
Volume 12, Issue 1, Pages 82-91

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/ppap.201400114

Keywords

microcrystalline films; microcrystalline silicon oxides; plasma chemistry; plasma-enhanced chemical vapor deposition (PECVD)

Funding

  1. Federal Ministry of Education and Research (BMBF)
  2. Federal Ministry of Environment (BMU)
  3. state government of Berlin (SENBWF) in the framework of the program Spitzenforschung und Innovation in den Neuen Landern [03IS2151]
  4. SiliziumDS12plus project [0325317C]

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The advanced opto-electronic properties of microcrystalline silicon oxide (mu c-SiOx:H) thin film layers deposited by means of plasma enhanced chemical vapor deposition (PECVD) resulted in several applications of this material especially in solar cells and modules in the last years. We investigated the plasma chemistry during the PECVD of mc-SiOx: H using in situ plasma diagnostics. Plasma properties are related to the properties of resulting mc-SiOx: H films measured ex situ. Two different deposition regimes were identified. Besides the standard low pressure regime, a high pressure regime was found, which lead to mu c-SiOx:H layers with high crystallinities and low refractive indices.

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