Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment

Title
Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment
Authors
Keywords
Waste printed circuit board, Gold, Leaching, Iodide, Supercritical water
Journal
WASTE MANAGEMENT
Volume 41, Issue -, Pages 134-141
Publisher
Elsevier BV
Online
2015-04-28
DOI
10.1016/j.wasman.2015.02.020

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