Strain rates in molecular dynamics simulations of nanocrystalline metals

Room-temperature dislocation climb in metallic interfaces

(2009) Jian Wang et al.   APPLIED PHYSICS LETTERS

Enhanced strain-rate sensitivity in fcc nanocrystals due to grain-boundary diffusion and sliding

(2008) Yujie Wei et al.   ACTA MATERIALIA

Atomistic modeling of the interaction of glide dislocations with “weak” interfaces

(2008) J. Wang et al.   ACTA MATERIALIA

The stress–strain response of nanocrystalline metals: A statistical analysis of atomistic simulations

(2008) E. Bitzek et al.   ACTA MATERIALIA

Atomistic simulations of the shear strength and sliding mechanisms of copper–niobium interfaces

(2008) J. Wang et al.   ACTA MATERIALIA

Interactions between non-screw lattice dislocations and coherent twin boundaries in face-centered cubic metals

(2008) Z.-H. Jin et al.   ACTA MATERIALIA

The Hall–Petch breakdown at high strain rates: Optimizing nanocrystalline grain size for impact applications

(2008) Jason R. Trelewicz et al.   APPLIED PHYSICS LETTERS

Effect of normal loading on grain boundary migration and sliding in copper

(2008) D H Warner et al.   MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING

Quantitative description of plastic deformation in nanocrystalline Cu: Dislocation glide versus grain boundary sliding

(2008) N. Q. Vo et al.   PHYSICAL REVIEW B

Strain-Dependent Deformation Behavior in Nanocrystalline Metals

(2008) Hongqi Li et al.   PHYSICAL REVIEW LETTERS

Dislocation Cross-Slip in Nanocrystalline fcc Metals

(2008) E. Bitzek et al.   PHYSICAL REVIEW LETTERS

Williamson–Hall anisotropy in nanocrystalline metals: X-ray diffraction experiments and atomistic simulations

(2007) S. Brandstetter et al.   ACTA MATERIALIA

Dislocations and twins in nanocrystalline Ni after severe plastic deformation: the effects of grain size

(2007) X.L. Wu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Grain boundary dislocation sources in nanocrystalline copper

(2007) M.A. Tschopp et al.   SCRIPTA MATERIALIA